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product structure : silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays . 1/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 tsz22111 14 001 www.rohm.com lin transceiver for automotive BD41030FJ-C general description BD41030FJ-C is the best transceiver for bus system which need lin (local interconnect network) master and slave protocol. BD41030FJ-C is available in small sop package and low standby electricity consumption in sleep mode. features ? aec-q100 qualified (note 1) ? absolute maximum ratings of lin pin is -27v to+40v ? max transmission rate 20kbps ? low electro magnetic emission (eme) ? high electro magnetic immunity (emi) ? high impedance at power off for bus ? interface (rxd/txd) with protocol layer corresponds to 3.3v/5.0v logic. ? built-in terminator for lin slave ? standby power consumption in sleep mode ? transmit data(txd) dominant time-out function ? resistant to lin-bat/gnd short-circuit ? built-in thermal shut down(tsd) (note1:grade1) applications ? lin communication for automotive networks. key specifications ? supply voltage: 5v to 27v ? supply current (sleep mode): 1 a to 8 a ? supply current: 100 a to 1000 a (standby mode; recessive) ? supply current: 100 a to 1000 a (normal mode; recessive) ? supply current: 200 a to 2000 a (normal mode; dominant) package(s) w(typ) x d(typ) x h(max) sop-j8 4.90mm x 6.00mm x 1.65mm typical application circuit(s) figure 1. typical application circuit sop-j8 datashee t downloaded from: http:///
datasheet d a t a s h e e t 2/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C contents general de scripti on ............................................................................................................ ............................................................1 featur es....................................................................................................................... ...................................................................1 applicat ions ................................................................................................................... .................................................................1 key specif icati ons............................................................................................................. ..............................................................1 package (s)......................................................................................................................................................................................1 typical applicat ion circu it(s) ................................................................................................. ..........................................................1 contents ....................................................................................................................... ..................................................................2 pin configur ation( s) ........................................................................................................................................................................3 pin descrip tion(s) ............................................................................................................. ..............................................................3 block diagr am(s) ............................................................................................................................................................................3 description of blo ck(s) ........................................................................................................ ............................................................4 absolute maxi mum ra tings ............................................................................................................................................................6 recommended operat ing cond itions ............................................................................................... ..............................................6 electrical char acterist ics..................................................................................................... ............................................................7 typical perfor mance cu rves..................................................................................................... .................................................... 11 timing c hart .................................................................................................................................................................................34 application exampl e(s) .................................................................................................................................................................36 power dissi pation .........................................................................................................................................................................37 i/o equivalent circui t(s) .................................................................................................................................................................38 operational notes ............................................................................................................................... ........................................39 ordering info rmation .....................................................................................................................................................................41 marking di agrams............................................................................................................... ..........................................................41 physical dimension, tape and reel in formation...........................................................................................................................42 revision history............................................................................................................................................................................43 downloaded from: http:///
datasheet d a t a s h e e t 3/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C pin configuration(s) 8 7 6 5 1 2 3 4 inh rxd txd nslp bat nwake lin gnd (top view) figure 2. pin configuration pin description(s) table 1. pin description pin no. pin name function 1 rxd received data output pin (open drain). l is output at standby mode. 2 nslp sleep control input pin (l active mode). shift to sleep mode by l input in normal mode. 3 nwake local wake-up input pin (l active mode). active at leading edge. 4 txd transmission data input pin(l active mode) 5 gnd ground 6 lin lin bus input and output pin. 7 bat power supply pin. 8 inh sleep status indicator. hi-z at sleep mode and h in the other modes. block diagram(s) figure 3. block diagram downloaded from: http:///
datasheet d a t a s h e e t 4/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C description of block(s) 1. sleep mode in sleep mode, the transmit/receive function is not ava ilable and BD41030FJ-C is under the condition of low power consumption mode. in this mode BD41030FJ-C shifts to sleep mode at startup of power supply (v bat ) when nslp is l or in normal mode also when pin nslp is l. during sleep mode, one of the following wa ke-up events triggers a shift of state: ? pin nwake h l (shift to standby mode) ? pin lin h l h (shift to standby mode) ? pin nslp l h (shift to normal mode) the above-mentioned wake-up events shift the mode wh en a state remains for a given period of time (t nwake , t bus , t gotonorm ). hereinafter, a wake-up event on pi n nwake is defined as local wake-up, and a wake-up event on pin lin is defined as remote wake-up. 2. standby mode when a wake-up event occurs on pin nwake or pin lin in sleep mode, BD41030FJ-C shifts to standby mode. in standby mode, pins become the following state: ? pin inh h ( P v bat voltage) ? pin rxd l (informs the microcontroller of being in standby mode.) ? pin lin slave resistor on BD41030FJ-C shifts from standby mode to normal mode when pin nslp input switches to h. 3. normal mode BD41030FJ-C shifts to normal mode when pin nslp switches to h in sleep mode or standby mode. in normal mode, data can be transmitted or received through the bus line. when receiving data, t he transceiver informs a lin bus input from pin rxd to the microcontroller. when transmitting data, the transceiver converts a txd input signal to a slew-rate-controlled lin bus signal and informs the bus line of the converted signal. the maximum operating frequency in this mode is 10 khz. from this mode, BD41030FJ-C shifts to sleep mode when pin nslp input switches to l and this state remains for a given period of time (t gotosleep ). figure 4. state transition chart table 2. the state of the pin in each mode mode nslp txd rxd inh transmitter sleep mode l pull-down hi-z hi-z off standby mode l pull-down l h off normal mode h pull-down h recessive state l dominant state h on downloaded from: http:///
datasheet d a t a s h e e t 5/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C 4. txd dominant time-out counters fail-safe function a txd dominant time-out counter prevents the bus line from being driven to a permanent dominant state (blocking all network communication) in case pin txd input is forced pe rmanently low by a hardware and/or software application failure. the timer is trigged by a negative edge on pin txd and in case the value exceeds the internal timer value (t dom ), the transmitter becomes disabled and drives the bus line into a recessive state. the timer is reset by a positive edge on pin txd input. 5. fail-safe function ? pin txd provides a pull-down to gnd in order to force a pred efined level on input pin txd in case the pin txd is not connected. ? pin nslp provides a pull-down to gnd in order to force t he transceiver into sleep mode in case the pin nslp is not connected. ? pin rxd is hi-z in case of lost power supply on pin v bat . ? the output driver at pin lin will be off when junction temperature exceeds t j activating the tsd circuit without relation to input signal at pin txd. however, when junction temperature drops below t j the output driver at pin lin will depend again on the input signal at pin txd. downloaded from: http:///
datasheet d a t a s h e e t 6/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C absolute maximum ratings (ta = 25c) table 3. absolute maximum ratings parameter symbol rating unit supply voltage on pin bat (note 1) v bat -0.3 to +40.0 v dc voltage on pin txd, rxd, nslp v txd, v rxd, v nslp -0.3 to +7.0 v dc voltage on pin lin v lin -27 to +40 v dc voltage on pin nwake v nwake -1 to +40 v current on pin nwake (note 2) i nwake -15 ma dc voltage on pin inh v inh -0.3 to v bat + 0.3 v output current at pin inh i inh -50 to +15 ma power dissipation (note 3) pd 674 mw storage temperature range t stg -55 to +150 c junction max temperature t jmax +150 c electro static discharge hbm (note 4) v esd 4000 v (note 1) pd, aso should not be exceeded. (note 2) available only when v nwake < v gnd- 0.3v. current flow to pin gnd. (note 3) regarding above ta=25c, pd decreased at 5.40mw/c for temperatures when mounted on 70x70x1.6mm glass-epoxy pcb. (note 4) jedec qualified. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating conditions table 4. recommended operating conditions parameter symbol range unit supply voltage v bat 5.0 to 27.0 v operating temperature range t opr -40 to +125 c downloaded from: http:///
datasheet d a t a s h e e t 7/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C electrical characteristics (ta= -40 to +125c; v bat =5 to 27v; r l(lin-bat) =500 ? ; typical values are given at ta=25c; v bat =12v; unless otherwise specified) table 5. electrical characteristics parameter symbol min typ max unit conditions bat supply current 1 on pin bat (sleep mode) i bat1 1 3 8 a sleep mode. v lin = v bat v nwake = v bat v txd = 0v v nslp = 0v supply current 2 on pin bat (standby mode, recessive) i bat2 100 400 1000 a standby mode. v lin = v bat (bus: recessive) v inh = v bat v nwake = v bat v txd = 0v v nslp = 0v supply current 3 on pin bat (note 1) (standby mode, dominant) i bat3 300 900 2000 a standby mode. v bat = 12v v lin = 0v (bus: dominant) v inh = v bat v nwake = v bat v txd = 0v v nslp = 0v supply current 4 on pin bat (normal mode, recessive) i bat4 100 400 1000 a normal mode. v lin = v bat (bus: recessive) v inh = v bat v nwake = v bat v txd = 5v v nslp = 5v supply current 5 on pin bat (note 1) (normal mode, dominant) i bat5 200 1000 2000 a normal mode. v bat = 12v (bus: dominant) v inh = v bat v nwake = v bat v txd = 0v v nslp = 5v txd high level input voltage v ih 2.0 - 7.0 v low level input voltage v il -0.3 - +0.8 v hysteresis voltage v hys 0.03 - 0.50 v pull-down resistor r txd 125 350 800 k ? v txd = 5v low level input current i il -5.0 0.0 +5.0 a v txd = 0v nslp high level input voltage v ih 2.0 - 7.0 v low level input voltage v il -0.3 - +0.8 v hysteresis voltage v hys 0.03 - 0.50 v pull-down resistor r nslp 125 350 800 k ? v nslp = 5v low level input current i il -5.0 0.0 +5.0 a v nslp = 0v rxd (open-drain) low level output current i ol 1.3 3.5 - ma normal mode. v lin = 0v v rxd = 0.4v high level leakage current i ozh -5.0 0.0 +5.0 a normal mode. v lin = v bat v rxd = 5v (note 1) when v bat is 12v or more, add to the circuit current the value calculated by the following expression because i bat depends on pull-up resistor inside lin terminal. (20k ? is the minimum value of pull-up resistor inside lin terminal) ? ? ? k v 20 12 bat se) bat(increa v i downloaded from: http:///
datasheet d a t a s h e e t 8/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C electrical characteristics (ta= -40 to +125c; v bat =5 to 27v; r l(lin-bat) =500 ? ; typical values are given at ta=25c; v bat =12v; unless otherwise specified) table 6. electrical characteristics parameter symbol min ty p max unit conditions nwake high level input voltage v ih v bat - 1.0 - v bat + 0.3 v low level input voltage v il -0.3 - v bat - 3.3 v high level leakage current i ih -5.0 0.0 +5.0 a v nwake = 27v v bat = 27v pull-up current i il -30 -10 -3 a v nwake = 0v inh switch-on resistance between pins bat and inh r inh - 30 50 ? standby mode, normal mode. i inh = -15ma, v bat = 12v high level leakage current i ozh -5.0 0.0 +5.0 a sleep mode. v inh = v bat = 27v lin lin recessive output voltage v o_rec v bat 0.9 - v bat v v txd = 5v, i lin = 0ma v o_dom1 - - 1.2 v v txd = 0v, v bat = 7.3v v o_dom2 0.6 - - v v txd = 0v, v bat = 7.3v r l(lin-bat) = 1k ? v o_dom3 - - 2.0 v v txd = 0v, v bat = 18v lin dominant output voltage v o_dom4 0.8 - - v v txd = 0v, v bat = 18v r l(lin-bat) = 1k ? high level leakage current i ih -5.0 0.0 +5.0 a v lin = v bat lin pull-up current i il -10.0 -5.0 -2.0 a sleep mode. v lin = v nslp = 0v pull-up resistance (slave termination resistance to pin bat) r slave 20 30 47 k ? standby mode, normal mode. v lin = 0v, v bat = 12v capacitance of pin lin c lin - - 250 pf short-circuit output current i o_sc0 40 - 200 ma v lin = v bat = 18v, v txd = 0v t < t dom input leakage current at the receiver operating (included pull-up resistor) i bus_pas_dom -1 - - ma v lin = 0v v bat = 12v v txd = 5v input leakage current at the receiver operating i bus_pas_rec - - 20 a v lin = 18v v bat = 8v v txd = 5v loss of ground leakage current i bus_no_gnd -1 - 1 ma v bat = v gnd = 12v v lin = 0v to 18v loss of battery leakage current i bus_no_bat - - 100 a v bat = 0v v lin = 18v receiver threshold voltage v th_rx v bat x 0.4 - v bat x 0.6 v v bat = 7.3v to 27.0v receiver center voltage (note 2) v cn_rx v bat x 0.475 v bat x 0.500 v bat x 0.525 v v bat = 7.3v to 27.0v v cn_rx = (v th_dom + v th_rec )/2 receiver threshold hysteresis voltage (note 2) v th_hys v bat x 0.100 v bat x 0.140 v bat x 0.175 v v bat = 7.3v to 27.0v v th_hys = v th_rec - v th_dom downloaded from: http:///
datasheet d a t a s h e e t 9/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C electrical characteristics (ta= -40 to +125c; v bat =5 to 27v; r l(lin-bat) =500 ? ; typical values are given at ta=25c; v bat =12v; unless otherwise specified) table 7. electrical characteristics parameter symbol min ty p max unit conditions ac characteristics (note 6) t proprxdom - - 6.0 s rxd propagation delay t proprxrec - - 6.0 s rxd propagation delay failure S t d_(bus-rxd) -2.0 0.0 +2.0 s normal mode c l(lin-gnd) = 0nf r l(lin-bat) = voltage on lin externally forced. lin t f , t r < 20ns c rxd = 20pf r rxd = 2.4k ? S t d_(bus-rxd)= t proprxdom -t proprxrec duty cycle 1 (note 3, note 4) d1 0.396 - - normal mode th rec(max) = 0.744 x v bat th dom(max) = 0.581 x v bat v bat =7.0 to 18.0v t bit =50 s duty cycle 2 (note 3, note 5) d2 - - 0.581 normal mode th rec(min) = 0.422 x v bat th dom(min) = 0.284 x v bat v bat =7.6 to 18.0v t bit =50 s duty cycle 3 (note 3, note 4) d3 0.417 - - normal mode th rec(max) = 0.778 x v bat th dom(max) = 0.616 x v bat v bat =7.0 to 18.0v t bit =96 s duty cycle 4 (note 3, note 5) d4 - - 0.590 normal mode th rec(min) = 0.389 x v bat th dom(min) = 0.251 x v bat v bat =7.6 to 18.0v t bit =96 s dominant time for wake-up via bus t bus 30 70 150 s sleep mode (remote wake-up) dominant time for wake-up via pin nwake t nwake 7 20 50 s sleep mode (local wake-up) time period for mode change from sleep or standby mode into normal mode t gotonorm 2 5 10 s shift from sleep/standby mode to normal mode time period for mode change from normal mode into sleep mode t gotosleep 2 5 10 s shift from normal mode to sleep mode txd dominant time out t dom 6 12 20 ms v txd = 0v (note 2) (note 3) load condition at bus ( c l(lin-gnd) ;r l(lin-bat) ) : 1nf;1k ? / 6.8nf;660 ? / 10nf;500 ? (note 4) bit (min) bus_rec 2 3 ,1 xt t d d ? downloaded from: http:///
datasheet d a t a s h e e t 10/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C (note 5) (note 6) ac characteristic evaluation circuit diagram inh rxd txd nslp nwake lin gnd bat vc c 2.4k ? 20pf 100nf r l c l bit (max) bus_rec 2 4 ,2 xt t d d ? downloaded from: http:///
datasheet d a t a s h e e t 11/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C typical performance curves figure 5. supply current(sleep mode)- temperature characteristic figure 6. supply current(sleep mode)- voltage characteristic figure 7. supply current(standby mode, recessive)- temperature characteristic figure 8. supply current(standby mode, recessive)- voltage characteristic 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 -50 -25 0 25 50 75 100 125 150 supply current(sleep mode) : i bat1 [ a] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 5 1 01 52 02 53 0 supply current(sleep mode) : i bat1 [ a] supply voltage : bat[v] ta=-40c ta=25c ta=125c 0 100 200 300 400 500 600 700 800 900 1,000 -50 -25 0 25 50 75 100 125 150 supply current(standby mode,recessive) : i bat2 [ a] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v 0 100 200 300 400 500 600 700 800 900 1,000 5 1 01 52 02 53 0 supply current(standby mode,recessive) : i bat2 [ a] supply voltage : bat[v] ta=-40c ta=25c ta=125c downloaded from: http:///
datasheet d a t a s h e e t 12/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C typical performance curves - continued figure 9. supply current(standby mode, dominant)- temperature characteristic figure 10. supply current(standby mode, dominant)- voltage characteristic figure 11. supply current(normal mode, recessive)- temperature characteristic figure 12. supply current(normal mode, recessive)- voltage characteristic 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 -50 -25 0 25 50 75 100 125 150 supply current(standby mode,dominant) :i bat3 [ma] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 5 1 01 52 02 53 0 supply current(standby mode,dominant) :i bat3 [ma] supply voltage : bat[v] ta=125c ta=-40c ta=25c 0 100 200 300 400 500 600 700 800 900 1,000 -50 -25 0 25 50 75 100 125 150 supply current(normal mode,recessive) : i ibat4 [ a] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v 0 100 200 300 400 500 600 700 800 900 1,000 51 52 5 supply current(normal mode,recessive) : i ibat4 [ a] supply voltage : bat[v] ta=125c ta=25c ta=-40c downloaded from: http:///
datasheet d a t a s h e e t 13/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C typical performance curves - continued figure 13. supply current(normal mode, dominant)- temperature characteristic figure 14. supply current(normal mode, dominant) - voltage characteristic figure 15. txd high-level input voltage- temperature characteristic figure 16. txd high-level input voltage- voltage characteristic 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50-25 0 255075100125150 supply current(normal mode,dominant) :i bat5 [ma] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v 0.0 0.5 1.0 1.5 2.0 2.5 3.0 51 52 5 supply current(normal mode,dominant) :i bat5 [ma] supply voltage : bat[v] ta=125c ta=25c ta=-40c 0.8 1.0 1.2 1.4 1.6 1.8 2.0 -50 -25 0 25 50 75 100 125 150 txd high-level input voltage : v ih [v] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v 0.8 1.0 1.2 1.4 1.6 1.8 2.0 5 1 01 52 02 53 0 txd high-level input voltage : v ih [v] supply voltage : bat[v] ta=125c ta=25c ta=-40c downloaded from: http:///
datasheet d a t a s h e e t 14/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C typical performance curves - continued figure 17. txd low-level input voltage- temperature characteristic figure 18. txd low-level input voltage- voltage characteristic figure 19. txd input pull-down resistor- temperature characteristic figure 20. txd input pull-down resistor- voltage characteristic 0.8 1.0 1.2 1.4 1.6 1.8 2.0 -50 -25 0 25 50 75 100 125 150 txd low-level input voltage : v il [v] ambient temperature : ta[ ] v bat =27v v bat =5v v bat =12v 0.8 1.0 1.2 1.4 1.6 1.8 2.0 5 1 01 52 02 53 0 txd low-level input voltage : v il [v] supply voltage : bat[v] ta=125c ta=25c ta=-40c 100 200 300 400 500 600 700 800 -50-25 0 255075100125150 txd input pull-down resistor : r txd [k ? ] ambient temperature : ta[ ] v bat =12v v bat =27v v bat =5v 100 200 300 400 500 600 700 800 5 1 01 52 02 53 0 txd input pull-down resistor : r txd [k ? ] supply voltage : bat[v] ta=125c ta=25c ta=-40c downloaded from: http:///
datasheet d a t a s h e e t 15/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C typical performance curves - continued figure 21. txd low-level input current- temperature characteristic figure 22. txd low-level input current- voltage characteristic figure 23. nslp high-level input voltage- temperature characteristic figure 24. nslp high-level input voltage- voltage characteristic -5.0 -4.0 -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 -50-25 0 255075100125150 txd low-level input current : i l [ a] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v -5.0 -4.0 -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 5 1 01 52 02 53 0 txd low-level input current : i l [ a] supply voltage : bat[v] ta=125c ta=25c ta=-40c 0.8 1.0 1.2 1.4 1.6 1.8 2.0 -50 -25 0 25 50 75 100 125 150 nslp high-level input voltage : v ih [v] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v 0.8 1.0 1.2 1.4 1.6 1.8 2.0 5 1 01 52 02 53 0 nslp high-level input voltage : v ih [v] supply voltage : bat[v] ta=125c ta=25c ta=-40c downloaded from: http:///
datasheet d a t a s h e e t 16/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C typical performance curves - continued figure 25. nslp low-level input voltage- temperature characteristic figure 26. nslp low-level input voltage- voltage characteristic figure 27. nslp input pull-down resistor- temperature characteristic figure 28. nslp input pull-down resistor- voltage characteristic 0.8 1.0 1.2 1.4 1.6 1.8 2.0 -50 -25 0 25 50 75 100 125 150 nslp low-level input voltage : v il [v] ambient temperature : ta[ ] v bat =5v v bat =27v v bat =12v 0.8 1.0 1.2 1.4 1.6 1.8 2.0 5 1 01 52 02 53 0 nslp low-level input voltage : v il [v] supply voltage : bat[v] ta=25c ta=125c ta=-40c 100 200 300 400 500 600 700 800 -50-25 0 255075100125150 nslp input pull-down resistor : r nslp [k ? ] ambient temperature : ta[ ] v bat =5v v bat =27v v bat =12v 100 200 300 400 500 600 700 800 5 1 01 52 02 53 0 nslp input pull-down resistor : r nslp [k ? ] supply voltage : bat[v] ta=125c ta=25c ta=-40c downloaded from: http:///
datasheet d a t a s h e e t 17/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C typical performance curves - continued figure 29. nslp low-level input current- temperature characteristic figure 30. nslp low-level input current- voltage characteristic figure 31. rxd low-level output current- temperature characteristic figure 32. rxd low-level output current- voltage characteristic -5.0 -4.0 -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 -50-25 0 255075100125150 nslp low-level input current : i l [ a] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v -5.0 -4.0 -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 5 1 01 52 02 53 0 nslp low-level input current : i l [ a] supply voltage : bat[v] ta=125c ta=25c ta=-40c 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 -50-25 0 255075100125150 rxd low-level output current : i ol [ma] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5 1 01 52 02 53 0 rxd low-level output current : i ol [ma] supply voltage : bat[v] ta=-40c ta=25c ta=125c downloaded from: http:///
datasheet d a t a s h e e t 18/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C typical performance curves - continued figure 33. rxd high-level output leakage current- temperature characteristic figure 34. rxd high-level output leakage current- voltage characteristic figure 35. nwake h/l-level input voltage- temperature characteristic figure 36. nwake h/l-level input voltage- voltage characteristic -5.0 -4.0 -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 -50-25 0 255075100125150 rxd high-level output leakage current : i ozh [ a] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v -5.0 -4.0 -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 5 1 01 52 02 53 0 rxd high-level output leakage current : i ozh [ a] supply voltage : bat[v] ta=125c ta=25c ta=-40c 0 5 10 15 20 25 30 -50 -25 0 25 50 75 100 125 150 nwake h/l-level input voltage : v ih/il [v] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v 0 5 10 15 20 25 30 5 1 01 52 02 53 0 nwake h/l-level input voltage : v ih/il [v] supply voltage : bat[v] ta=125c ta=25c ta=-40c downloaded from: http:///
datasheet d a t a s h e e t 19/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C typical performance curves - continued figure 37. nwake high-level input leakage current - temperature characteristic figure 38. nwake high-level input leakage current- voltage characteristic figure 39. nwake pull-up current- temperature characteristic figure 40. nwake pull-up current- voltage characteristic -5.0 -4.0 -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 -50 -25 0 25 50 75 100 125 150 nwake high-level input leakage current : i h [ a] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v -5.0 -4.0 -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 5 1 01 52 02 53 0 nwake high-level input leakage current : i h [ a] supply voltage : bat[v] ta=125c ta=-40c ta=25c -30.0 -25.0 -20.0 -15.0 -10.0 -5.0 0.0 -50 -25 0 25 50 75 100 125 150 nwake pull-up current: i l [ a] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v -30.0 -25.0 -20.0 -15.0 -10.0 -5.0 0.0 5 1 01 52 02 53 0 nwake pull-up curren : i l [ a] supply voltage : bat[v] ta=125c ta=-40c ta=25c downloaded from: http:///
datasheet d a t a s h e e t 20/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C typical performance curves - continued figure 41. inh switch on resistance- temperature characteristic figure 42. inh switch on resistance- voltage characteristic figure 43. inh high-level leakage current- temperature characteristic figure 44. inh high-level leakage current- voltage characteristic 0 10 20 30 40 50 -50 -25 0 25 50 75 100 125 150 inh switch on resistance : r inh [ ? ] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v 0 10 20 30 40 50 5 1 01 52 02 53 0 inh switch on resistance: r inh [ ? ] supply voltage : bat[v] ta=125c ta=25c ta=-40c -5.0 -4.0 -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 -50-25 0 255075100125150 inh high-level leakage current: i ozh [ a] ambient temperature : ta[ ] v bat =27v v bat =5v v bat =12v -5.0 -4.0 -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 5 1 01 52 02 53 0 inh high-level leakage current : i ozh [ a] supply voltage : bat[v] ta=125c ta=25c ta=-40c downloaded from: http:///
datasheet d a t a s h e e t 21/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C typical performance curves - continued figure 45. lin recessive output voltage- temperature characteristic figure 46. lin recessive output voltage- voltage characteristic figure 47. lin dominant output voltage(lin=500 ? )- temperature characteristic figure 48. lin dominant output voltage(lin=500 ? )- voltage characteristic 0 5 10 15 20 25 30 -50 -25 0 25 50 75 100 125 150 lin recessive output voltage : v o_rec [v] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v 0 5 10 15 20 25 30 5 1 01 52 02 53 0 lin recessive output voltage : v o_rec [v] supply voltage : bat[v] ta=125c ta=25c ta=-40c 0.0 0.5 1.0 1.5 2.0 2.5 -50 -25 0 25 50 75 100 125 150 lin dominant output voltage(lin=500 ? ) : v o_dom [v] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v 0.0 0.5 1.0 1.5 2.0 2.5 5 1 01 52 02 53 0 lin dominant output voltage(lin=500 ? ) : v o_dom [v] supply voltage : bat[v] ta=125c ta=25c ta=-40c downloaded from: http:///
datasheet d a t a s h e e t 22/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C typical performance curves - continued figure 49. lin dominant output voltage(lin=1k ? ) - temperature characteristic figure 50. lin dominant output voltage(lin=1k ? ) -voltage characteristic figure 51. lin high-level leakage current- temperature characteristic figure 52. lin high-level leakage current- voltage characteristic 0.0 0.5 1.0 1.5 2.0 2.5 -50 -25 0 25 50 75 100 125 150 lin dominant output voltage(lin=1k ? ) : v o_dom [v] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v 0.0 0.5 1.0 1.5 2.0 2.5 5 1 01 52 02 53 0 lin dominant output voltage(lin=1k ? ) : v o_dom [v] supply voltage : bat[v] ta=125c ta=25c ta=-40c -5.0 -4.0 -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 -50-25 0 255075100125150 lin high-level leakage current : i ih [ a] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v -5.0 -4.0 -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 5 1 01 52 02 53 0 lin high-level leakage current : i ih [ a] supply voltage : bat[v] ta=125c ta=-40c ta=25c downloaded from: http:///
datasheet d a t a s h e e t 23/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C typical performance curves - continued figure 53. lin pull-up current- temperature characteristic figure 54. lin pull-up current- voltage characteristic figure 55. lin slave termination resistance- temperature characteristic figure 56. lin slave termination resistance- voltage characteristic -10.0 -8.0 -6.0 -4.0 -2.0 0.0 -50-25 0 255075100125150 lin pull-up current : i l [ a] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v -10.0 -8.0 -6.0 -4.0 -2.0 0.0 5 1 01 52 02 53 0 lin pull-up current : i l [ a] supply voltage : bat[v] ta=125c ta=-40c ta=25c 20 25 30 35 40 45 50 -50 -25 0 25 50 75 100 125 150 lin slave termination resistance : r slave [k ? ] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v 20 25 30 35 40 45 50 5 1 01 52 02 53 0 lin slave termination resistance : r slave [k ? ] supply voltage : bat[v] ta=125c ta=25c ta=-40c downloaded from: http:///
datasheet d a t a s h e e t 24/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C typical performance curves - continued figure 57. lin short-circuit output current- temperature characteristic figure 58. lin short-circuit output current- voltage characteristic figure 59. lin input leakage current at the receiver- temperature characteristic figure 60. lin input leakage current at the receiver- voltage characteristic 40 60 80 100 120 140 160 180 200 -50-25 0 255075100125150 lin short-circuit output current : i o_sc [ma] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v 40 60 80 100 120 140 160 180 200 10 15 20 25 30 lin short-circuit output current: i o_sc [ma] supply voltage : bat[v] ta=-40c ta=25c ta=125c -1.5 -1.0 -0.5 0.0 -50 -25 0 25 50 75 100 125 150 lin input leakage current at the receiver :i bus_pas_dom [ma] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v -1.5 -1.0 -0.5 0.0 5 1 01 52 02 53 0 lin input leakage current at the receiver : i bus_pas_dom [ma] supply voltage : bat[v] ta=125c ta=25c ta=-40c downloaded from: http:///
datasheet d a t a s h e e t 25/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C typical performance curves - continued figure 61. lin receiver recessive input leakage current- temperature characteristic figure 62. lin receiver recessive input leakage current- voltage characteristic figure 63. lin loss of ground leakage current- temperature characteristic figure 64. lin loss of ground leakage current- voltage characteristic 0.0 4.0 8.0 12.0 16.0 20.0 -50 -25 0 25 50 75 100 125 150 lin receiver recessive input leakage current : i bus_pas_rec [ a] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v 0.0 4.0 8.0 12.0 16.0 20.0 5 1 01 52 0 lin receiver recessive input leakage current : i bus_pas_rec [ a] supply voltage : bat[v] ta=-40c ta=125c ta=25c -1.0 -0.8 -0.6 -0.4 -0.2 0.0 0.2 0.4 0.6 0.8 1.0 -50 -25 0 25 50 75 100 125 150 lin loss of ground leakage current : i bus_no_gnd [ma] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v -1.0 -0.8 -0.6 -0.4 -0.2 0.0 0.2 0.4 0.6 0.8 1.0 0 5 10 15 20 lin loss of ground leakage current : i bus_no_gnd [ma] supply voltage : lin[v] ta=125c ta=25c ta=-40c downloaded from: http:///
datasheet d a t a s h e e t 26/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C typical performance curves - continued figure 65. lin loss of battery leakage current- temperature characteristic figure 66. lin loss of battery leakage current- voltage characteristic figure 67. lin receiver hi-level threshold voltage- temperature characteristic figure 68. lin receiver hi-level threshold voltage- voltage characteristic 0 10 20 30 40 50 60 70 80 90 100 -50-25 0 255075100125150 lin loss of battery leakage current : i bus_no_bat [ a] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v 0 10 20 30 40 50 60 70 80 90 100 0 5 10 15 20 lin loss of battery leakage current : i bus_no_bat [ a] supply voltage : lin[v] ta=125c ta=-40c ta=25c 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 -50 -25 0 25 50 75 100 125 150 lin receiver hi-level threshold voltage : v _rx [v] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 5 1 01 52 02 53 0 lin receiver hi-level threshold voltage : v th_rx [v] supply voltage : bat[v] ta=125c ta=-40c ta=25c downloaded from: http:///
datasheet d a t a s h e e t 27/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C typical performance curves - continued figure 69. lin receiver low-level threshold voltage- temperature characteristic figure 70. lin receiver low-level threshold voltage- voltage characteristic figure 71. lin receiver center voltage- temperature characteristic figure 72. lin receiver center voltage- voltage characteristic 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 -50 -25 0 25 50 75 100 125 150 lin receiver low-level threshold voltage : v _rx [v] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 5 1 01 52 02 53 0 lin receiver low-level threshold voltage : v th_rx [v] supply voltage : bat[v] ta=125c ta=-40c ta=25c 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 -50 -25 0 25 50 75 100 125 150 lin receiver center voltage : v cn_rx [v] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 5 1 01 52 02 53 0 lin receiver center voltage : v cn_rx [v] supply voltage : bat[v] ta=125c ta=-40c ta=25c downloaded from: http:///
datasheet d a t a s h e e t 28/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C typical performance curves - continued figure 73. rxd propagation delay failure_dominant- temperature characteristic figure 74. rxd propagation delay failure_dominant- voltage characteristic figure 75. rxd propagation delay failure_recessive- temperature characteristic figure 76. rxd propagation delay failure_recessive- voltage characteristic 0.0 1.0 2.0 3.0 4.0 5.0 6.0 -50 -25 0 25 50 75 100 125 150 rxd propagation delay failure_dominant : t proprxdom [ s] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v 0.0 1.0 2.0 3.0 4.0 5.0 6.0 5 1 01 52 02 53 0 rxd propagation delay failure_dominant : t proprxdom [ s] supply voltage : bat[v] ta=125c ta=-40c ta=25c 0.0 1.0 2.0 3.0 4.0 5.0 6.0 -50-25 0 255075100125150 rxd propagation delay failure_recessive : t proprxrec [ s] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v 0.0 1.0 2.0 3.0 4.0 5.0 6.0 5 1 01 52 02 53 0 rxd propagation delay failure_recessive : t proprxrec [ s] supply voltage : bat[v] ta=125c ta=25c ta=-40c downloaded from: http:///
datasheet d a t a s h e e t 29/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C typical performance curves - continued figure 77. duty cycle1- temperature characteristic figure 78. duty cycle1- voltage characteristic figure 79. duty cycle2- temperature characteristic figure 80. duty cycle2- voltage characteristic 0.40 0.45 0.50 0.55 0.60 -50-25 0 255075100125150 duty cycle1: d1 ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v 0.40 0.45 0.50 0.55 0.60 5 1 01 52 02 53 0 duty cycle1 : d1 supply voltage : bat[v] ta=125c ta=-40c ta=25c 0.40 0.45 0.50 0.55 0.60 -50-25 0 255075100125150 duty cycle2: d2 ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v 0.40 0.45 0.50 0.55 0.60 5 1 01 52 02 53 0 duty cycle2 : d2 supply voltage : bat[v] ta=125c ta=25c ta=-40c downloaded from: http:///
datasheet d a t a s h e e t 30/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C typical performance curves - continued figure 81. duty cycle3- temperature characteristic figure 82. duty cycle3- voltage characteristic figure 83. duty cycle4- temperature characteristic figure 84. duty cycle4- voltage characteristic 0.40 0.45 0.50 0.55 0.60 5 1 01 52 02 53 0 duty cycle3 : d3 supply voltage : bat[v] ta=125c ta=-40c ta=25c 0.40 0.45 0.50 0.55 0.60 -50-25 0 255075100125150 duty cycle4: d4 ambient temperature : ta[ ] v bat =27v v bat =5v v bat =12v 0.40 0.45 0.50 0.55 0.60 5 1 01 52 02 53 0 duty cycle4 : d4 supply voltage : bat[v] ta=125c ta=25c ta=-40c 0.40 0.45 0.50 0.55 0.60 -50-25 0 255075100125150 duty cycle3: d3 ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v downloaded from: http:///
datasheet d a t a s h e e t 31/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C typical performance curves - continued figure 85. dominant time for wake-up via bus- temperature characteristic figure 86. dominant time for wake-up via bus- voltage characteristic figure 87. dominant time for wake-up via nwake- temperature characteristic figure 88. dominant time for wake-up via nwake- voltage characteristic 30 50 70 90 110 130 150 -50 -25 0 25 50 75 100 125 150 dominant time for wake-up via bus : t bus [ s] ambient temperature : ta[ ] v bat =5v v bat =27v v bat =12v 30 50 70 90 110 130 150 5 1 01 52 02 53 0 dominant time for wake-up via bus : t bus [ s] supply voltage : bat[v] ta=-40c ta=25c ta=125c 10 15 20 25 30 35 40 45 50 -50 -25 0 25 50 75 100 125 150 dominant time for wake-up via nwake : t wake [ s] ambient temperature : ta[ ] v bat =27v v bat =5v v bat =12v 10 15 20 25 30 35 40 45 50 5 1 01 52 02 53 0 dominant time for wake-up via nwake : t wake [ s] supply voltage : bat[v] ta=-40c ta=25c ta=125c downloaded from: http:///
datasheet d a t a s h e e t 32/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www.rohm.com tsz22111 15 001 BD41030FJ-C typical performance curves - continued figure 89. time period for mode change (sleep/standby mode=>normal mode)- temperature characteristic figure 90. time period for mode change (sleep/standby mode=>normal mode)- voltage characteristic figure 91. time period for mode change (normal mode=>sleep mode)- temperature characteristic figure 92. time period for mode change (normal mode=>sleep mode)- voltage characteristic 0.0 2.0 4.0 6.0 8.0 10.0 -50 -25 0 25 50 75 100 125 150 time period for mode change (sleep/standby mode=>normal mode) : t gotonorm [ s] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v 0.0 2.0 4.0 6.0 8.0 10.0 5 1 01 52 02 53 0 time period for mode change (sleep/standby mode=>normal mode) :t gotonorm [ s] supply voltage : bat[v] ta=125c ta=-40c ta=25c 0.0 2.0 4.0 6.0 8.0 10.0 -50 -25 0 25 50 75 100 125 150 time period for mode change (normal mode=>sleep mode) : t gotosleep [ s] ambient temperature : ta[ ] v bat =5v v bat =27v v bat =12v 0.0 2.0 4.0 6.0 8.0 10.0 5 1 01 52 02 53 0 time period for mode change (normal mode=>sleep mode) :t gotosleep [ s] supply voltage : bat[v] ta=125c ta=25c ta=-40c downloaded from: http:///
datasheet d a t a s h e e t 33/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www. r ohm.com tsz22111 15 001 BD41030FJ-C typical performance curves - continued figure 93. txd dominant time out- temperature characteristic figure 94. txd dominant time out- voltage characteristic 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 -50-25 0 255075100125150 txd dominant time out : t dom [ms] ambient temperature : ta[ ] v bat =27v v bat =12v v bat =5v 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 5 1 01 52 02 53 0 txd dominant time out : t dom [ms] supply voltage : avdd[v] ta=125c ta=25c ta=-40c downloaded from: http:///
datasheet d a t a s h e e t 34/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www. r ohm.com tsz22111 15 001 BD41030FJ-C timing chart lin rxd 50% 50% 0% 0.5xv bat 0.5xv bat t proprxdom t proprxrec figure 95. ac characteristic timing chart th rec(max) th d om( max) th rec(min) th d om( mi n) v bat t bus_dom( max) t bus_rec(min) t bus_dom( min) t bus_rec(max) lin txd t bit t bit figure 96. bus timing chart sleep standby normal t datasheet d a t a s h e e t 35/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www. r ohm.com tsz22111 15 001 BD41030FJ-C figure 98. local wake-up (sleep standby normal) figure 99. wake-up/sleep-in with nslp (sleep normal sleep) downloaded from: http:///
datasheet d a t a s h e e t 36/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www. r ohm.com tsz22111 15 001 BD41030FJ-C application example(s) figure 100. application example downloaded from: http:///
datasheet d a t a s h e e t 37/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www. r ohm.com tsz22111 15 001 BD41030FJ-C power dissipation the value in the following graph is obtained at 25c when rohm standard substr ate (74.2 x 74.2 x 1.6mm 3 , surface layer copper foil 34.09mm 2 , substrate material fr4 and copper foil thickness 18m) is mounted. the value shows a monotonous decrease a bove 25c and becomes 0w at 150c. 0 100 200 300 400 500 600 700 800 0 25 50 75 100 12 5 150 ambient tempe rature : ta[ ] powe r dissipatio n : pd[mw] downloaded from: http:///
datasheet d a t a s h e e t 38/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www. r ohm.com tsz22111 15 001 BD41030FJ-C i/o equivalent circuit(s) rxd nslp nwake txd lin inh downloaded from: http:///
datasheet d a t a s h e e t 39/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www. r ohm.com tsz22111 15 001 BD41030FJ-C operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance s upply lines. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperatur e and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage except for pins the output and the i nput of which were designed to go below ground, ensure that no pins are at a voltage below that of the gr ound pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this abs olute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the ex pected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consi deration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always dischar ge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos transis tor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electr ic field from the outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
datasheet d a t a s h e e t 40/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www. r ohm.com tsz22111 15 001 BD41030FJ-C operational notes C continued 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n j unction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic . the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 101. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output curren t, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that pr events heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circui t that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are autom atically restored to normal operation. note that the tsd circuit operates in a situation that exceed s the absolute maximum rati ngs and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other t han protecting the ic from heat damage. downloaded from: http:///
datasheet d a t a s h e e t 41/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www. r ohm.com tsz22111 15 001 BD41030FJ-C ordering information b d 4 1 0 3 0 f j - ce 2 part number package fj:sop-j8 product rank c: for automotive packaging and forming specification e2: embossed tape and reel marking diagrams (top view) 41030 lot number 1pin mark downloaded from: http:///
datasheet d a t a s h e e t 42/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www. r ohm.com tsz22111 15 001 BD41030FJ-C physical dimension, tape and reel information package name sop-j8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin downloaded from: http:///
datasheet d a t a s h e e t 43/43 tsz02201-0e3e0h500640-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.06.12 rev.001 www. r ohm.com tsz22111 15 001 BD41030FJ-C revision history date revision changes 12.jun.2015 001 new release downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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